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Characterization of Cohesive and Interfacial Bonding Strength for Hybrid bonding
Characterization of Cohesive and Interfacial Bonding Strength for Hybrid bonding
Simulation and Experimental Analysis of Warpage, Thermal Expansion, and Shrinkage in Packages
Simulation and Experimental Analysis of Warpage, Thermal Expansion, and Shrinkage in Packages
Reliability of TGV Interposers and Glass-Core Substrates
Reliability of TGV Interposers and Glass-Core Substrates
FE Simulation of 2D–3.5D Packaging: Thermo-mechanical, Fatigue, Fracture
FE Simulation of 2D–3.5D Packaging: Thermo-mechanical, Fatigue, Fracture
Investigation of Mechanical Properties in Thin Films
Investigation of Mechanical Properties in Thin Films
Machine Learning-Based Optimization of Conventional Packaging Bonding Processes
Machine Learning-Based Optimization of Conventional Packaging Bonding Processes
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