Ph.D. in Mechanical Engineering, State University of New York at Binghamton, Binghamton, New York, USA (2012 - 2017)

  Thesis: Thermo-Mechanical problems and their solution in a 3D micro-electronics package using Cu-to-Cu direct bonding

  Advisor: Prof. Seung Bae (SB) Park

M.S.   in Mechanical Engineering, KAIST, Daejeon, South Korea (2009 - 2011)

  Thesis: A study on inclined conductive bump for electronic packaging

  Advisor: the late Prof. Choong Don Yoo (passed away in December 2010)

B.S.    in Mathematical Sciences, KAIST, Daejeon, South Korea (2004 - 2009)

  Exchange student in Mechanical Engineering (Advisor: Prof. Hiroki Kuwano), Tohoku University, Sendai, Japan (2007-2008) 

2025.03 - Present    Assistant Professor, University of Seoul, Seoul, South Korea

2019.05 - 2025.02   Senior Researcher,  Korea Institute of Machinery and Materials (한국기계연구원, KIMM), Daejeon, South Korea

2017.03 - 2019.04   Process Modeling Engineer, Corning Incorporated, Corning, New York, USA

2015.11 - 2017.03   Process Modeling Engineer, Pro-Unlimited (Corning Inc. Contracted), Corning, New York, USA

2013.07 - 2013.08   Internship, Samsung Techwin (currently Hanwha Aerospace), Pangyo, South Korea

2019.05 - Present  학술이사, 한국마이크로전자 및 패키징학회 (KMEPS)

2020.03 - Present  여성위원회, 한국정밀공학회

2024  신진상, 한국마이크로전자 및 패키징학회

2023  Best Interactive Paper, IEEE Electronics Packaging Technology Conference (EPTC)

2022  Best Paper Award, International Symposium on Microelectronics and Packaging (ISMP)

2022  최우수논문상, 한국정밀공학회 추계학술대회

2022  우수발표상, 한국생산제조학회