[13] Compliant Ultra-thin Die Attach for Curved Free-Form Electronics in Large Field of View LiDAR Detection (Submitted) 

[12] (2025) Seungjin Oh*, Jae Hak Lee, Seung Man Kim, Seongheum Han, Ah-Young Park, Hyunkyu Moon, Jun-Yeob Song, Overview of Testing Methods for Mechanical and Adhesion Properties of Materials in Semiconductor Packages, IEEE Transactions on Materials for Electron Devices

[11] (2024) Falguni Ahmed, SeungMin Shin, Joonho Song, Jung Yup Kim, Ah-Young Park,  and MunPyo Hong*. Analysis of deformation of thin polyimide film by pre-strained silicone elastomer. Materials Today Communications, 38, 107728.

[10] (2023) 김정엽*, 장성환, 박아영, 황보윤, 송준엽. 기판에 사전변형률이 인가된 박막의 구조 해석. 한국정밀공학회지, 40(2), 175-184.

[09] (2023) Hakyung Jeong, Jae Hak Lee, Seungman Kim, SeongHeum Han, Hyungyu Moon, Jun-Yeob Song, and Ah-Young Park*. Optimization of process parameters in micro-scale pneumatic aerosol jet printing for high-yield precise electrodes. Scientific Reports, 13(1), 21297.

[08] (2023) Sumin Kang*, Jae Hak Lee, Seungman Kim, Jaeseung Lim, Ah-Young Park, Seongheum Han, Jun-Yeob Song, and Seong-Il Kim. Machine Learning‐Based Solution for Thermomechanical Analysis of MMIC Packaging. Advanced Materials Technologies, 8(5), 2201479.

[07] (2021) Chukwudi Okoro*, Ah-Young Park, Tammie Allowatt, and Scott Pollard. Elimination of Thermo-Mechanically Driven Circumferential Crack Formation in Copper Through-Glass Via Substrate. IEEE Transactions on Device and Materials Reliability 21, no. 3: 354-360.

[06] (2019) 이재학*, 송준엽, 김승만, 김용진, 박아영. 유연 반도체 패키지 접속을 위한 폴리머 탄성범프 범핑 공정 개발 및 범프 변형 거동 분석. 마이크로전자 및 패키징학회지 26, no. 2: 31-43.

[05] (2016) Ah-Young Park, Satish C. Chaparala, & Seung Bae Park*. Risk assessment of the crack propagation and delamination of the Cu-to-Cu direct bonded (CuDB) interface. Microelectronics Reliability, 66, 113-121.

[04] (2016) Yeonsung Kim, Ah-Young Park, Chin-Li Kao, Michael Su, Bryan Black, and Seung Bae Park*. Prediction of Deformation during Manufacturing Processes of Silicon Interposer Package with TSVs. Microelectronics Reliability 65: 234-242

[03] (2015) Ah-Young Park*, Seung Bae Park, and Choong D. Yoo. Development of Inclined Conductive Bump (ICB) for Flip-Chip Interconnection. IEEE Transactions on Components, Packaging and Manufacturing Technology 5.2: 207-216

[02] (2009) Ah-Young Park, Sun Rak Kim, Muhammad A. Hammad, and Choong D. Yoo*. Modification of Pinch Instability Theory for Analysis of Spray Mode in GMAW. Journal of Physics D: Applied Physics, 42, 225503

[1]  To be updated