Advanced Packaging Lab.
첨단 반도체 패키징 연구실
첨단 반도체 패키징 연구실
Our research group studies advanced packaging processes, materials, equipment, and reliability, with a special focus on bonding and interconnection technologies, including wire bonding, flip-chip bonding, fluxless bonding, hybrid bonding, through silicon via (TSV), and through glass via(TGV), using finite element simulations and hands-on experiments.
We are currently recruiting motivated integrated B.S.-M.S., M.S., and Ph.D. students (학·석사 연계, 석사, 박사과정) who are interested in research on electronic packaging.
If you are undergraduate students interested in our lab, please note that we only accept students who plan to pursue a master’s degree (학·석사 연계). For undergraduate research assistants, we prefer that you take at least one course taught by the professor (excluding programming-related courses).
Postdoctoral positions are available only to applicants who have prior research experience in bonding and interconnection within the field of electronic packaging during their graduate studies.
If you're interested, please feel free to email me at apark@uos.ac.kr